By Mark (Mohammad) Tehranipoor, Ujjwal Guin, Domenic Forte
This well timed and exhaustive learn deals a much-needed exam of the scope and effects of the digital counterfeit exchange. The authors describe quite a few shortcomings and vulnerabilities within the digital part offer chain, which may end up in counterfeit built-in circuits (ICs). not just does this e-book supply an review of the present counterfeiting difficulties dealing with either the private and non-private sectors, it additionally deals sensible, real-world options for combatting this colossal threat.
· is helping novices and practitioners within the box through offering a complete heritage at the counterfeiting problem;
· provides cutting edge taxonomies for counterfeit varieties, try tools, and counterfeit defects, which permits for a close research of counterfeiting and its mitigation;
· offers step by step ideas for detecting forms of counterfeit ICs;
· bargains pragmatic and practice-oriented, real looking options to counterfeit IC detection and avoidance, for and government.
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Additional resources for Counterfeit Integrated Circuits: Detection and Avoidance
Tandex had bought the component through an independent distributor that had acquired the part through a manufacturer in Shenzhen, China. Further investigation revealed that the module was reworked and had found its way through the supply chain to the P-8A aircraft. In separate investigations, counterfeit IC components were also found on several essential military systems deployed by the US Army, such as high-altitude missiles, helicopters (SH-60B, AH-64 and CH-46), and aircrafts (C-17, C-130J and C-27J) .
5 Manufacturing test process 2 Counterfeit Integrated Circuits Design Fabrication Wafer Test Packaging Package Test Quality Assurance Final Test Distribution hundreds of ICs depending on the size and type of ICs and may worth hundreds of dollars. An untrusted entity may source these defective wafers to an assembly and produce defective or out-of-specification ICs. After wafer tests, the defect free chips are sent to assembly for packaging. The healthy chips are then sorted out by using package tests and the chips that have been damaged during the packaging process are discarded.
If watermarking strategies are not implemented or are weak, it may be possible for counterfeiters or personnel possessing unauthorized knowledge of the IP to simply copy the IP, make cloned semiconductor components and market them for profit. Such cloned components violate intellectual property rights of the rightful IP owners and could cause them significant losses in revenue. We will also present a novel DFAC measure to prevent cloned ICs getting into the supply chain in Chap. 11. 6 Forged Documentation The documentation shipped with any component contains information regarding its specifications, testing, certificates of conformance (CoC) and statement of work (SoW).